| 摘要 |
A CMP device and its driving method are provided to prevent scratches on a wafer surface due to slurry by discharging the residual slurry from a polishing pad. A head(220) is used for supporting a wafer(230) and rotating the wafer in one direction. A platen(200) is rotated reversely to the rotating direction of the head. A polishing pad(211) is installed on an upper surface of the platen. A slurry supply nozzle(240) is used for supplying slurry onto the polishing pad of the platen. A plurality of exhaust holes(212) penetrates the platen and the polishing pad. An air nozzle(250) is connected with exhaust holes. A vacuum unit is connected with one end of the air nozzle. An air valve is installed at the air nozzle. A signal transfer unit closes the air valve during a wafer polishing process and opens the air valve after the wafer polishing process.
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