发明名称 FLAT PANEL TYPE HEAT TRANSFER DEVICE USING HYDROPHILIC WICK, MANUFACTURING METHOD THEREOF AND CHIP SET COMPRISING THE SAME
摘要 Provided is a flat panel type heat transfer device for effectively dissipating heat generated from a heat source in contact with a casing, comprising the casing sealed and having a certain shape, a coolant loaded in the casing and undergoing phase transition, one or more flat panel type hydrophilic wick structures in contact with at least a portion of an inner surface of the casing, manufactured by aggregating fibers capable of absorbing the coolant, and providing a coolant passage leading the coolant to flow in a direction parallel to the inner surface of the casing, and one or more support structures, each having a plurality of through holes which provide coolant passages through which coolant in a vapor phase or a liquid phase flows, while supporting the hydrophilic wick structure such that the hydrophilic wick structure is in close contact with the inner surface of the casing, wherein the coolant fills a portion of a space in the casing and circulates in the space in a manner such that the coolant flows through the hydrophilic wick structure by means of capillary force generated in fine passages formed in the hydrophilic wick structure toward a relatively hot point, is evaporated by heat from a heat source, flows in a vapor phase toward a relatively low temperature point, condenses at the relatively low temperature point, flows back in a liquid phase to the relatively hot point, and repeats the cycle of evaporation and condensation.
申请公布号 KR100698462(B1) 申请公布日期 2007.03.23
申请号 KR20050001028 申请日期 2005.01.06
申请人 发明人
分类号 F28D15/02 主分类号 F28D15/02
代理机构 代理人
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