| 摘要 |
A method for preventing plasma damage due to potential difference is provided to remove the potential difference by moving a substrate to a process chamber so as to expose plasma after the substrate is rotated in a transfer chamber. A main process is performed to a substrate(110) in a process chamber(300) using a plasma(140). The substrate is moved to a transfer chamber(400). The transferred substrate is rotated. The rotated substrate in the transfer chamber is moved to the process chamber. Then, the substrate is repeatedly exposed by the plasma, thereby removing the potential difference.
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