| 摘要 |
A back grinding apparatus and a method for driving the same are provided to remove effectively silicon defects by directly scrubbing a wafer using a PVA(PolyVinyl Alcohol) brush and to remove silicon particles by using a surface DI spray nozzle. A back grinding apparatus for polishing a rear surface of a wafer(160) includes a DI(Deionized) water spray nozzle(145), and a PVA brush(141). The DI water spray nozzle sprays DI water on the front surface and the rear surface of the wafer polished by a polishing pad. The PVA brush is formed so as to grind the front surface of the wafer attached in a grinding tape.
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