| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a device for holding an electronic component which can perform coating of a fluid with high viscosity and ensure easy attachment/detachment of a head to/from a head holding member, and to provide a system and a method for mounting an electronic component. <P>SOLUTION: A suction surface 130 for a head holding member 52 is closely brought into contact with a face to be sucked 566 of a dispenser head 58 for forming a negative pressure chamber for head suction 162, and the dispenser head 58 is sucked by negative pressure. An adhesive housing chamber 570 is communicated with a positive pressure supply passage 100 through holding of the dispenser head 58 by the head holding member 52, and an adhesive 561 is discharged from a discharge nozzle 564 in predetermined amounts as the positive pressure is supplied. The head holding member 52 selectively sucks and holds a nozzle head, revolver head and dispenser head using the negative pressure for coating of the adhesive and mounting of an electronic component onto a circuit substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT |
