发明名称 |
POROUS THIN FILM, MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR DEVICE USING IT |
摘要 |
PROBLEM TO BE SOLVED: To provide a low dielectric constant thin film which is easily formed at a high speed. SOLUTION: This method comprises steps of: supplying a hole generating material and a framework generating material to the surface of a substrate by vapor phase; forming a thin film wherein the framework generated by the framework generating material is so demarcated as to enclose the hole generating material on the substrate surface; and forming holes by removing the hole generating material from the thin film to form a porous thin film which is so formed that the framework encloses the holes. COPYRIGHT: (C)2007,JPO&INPIT
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申请公布号 |
JP2007073914(A) |
申请公布日期 |
2007.03.22 |
申请号 |
JP20050262598 |
申请日期 |
2005.09.09 |
申请人 |
ROHM CO LTD;ASM JAPAN KK |
发明人 |
OKU YOSHIAKI;NAKANO AKINORI |
分类号 |
H01L21/316;C23C14/34;H01L21/768;H01L23/522 |
主分类号 |
H01L21/316 |
代理机构 |
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代理人 |
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地址 |
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