发明名称 POROUS THIN FILM, MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR DEVICE USING IT
摘要 PROBLEM TO BE SOLVED: To provide a low dielectric constant thin film which is easily formed at a high speed. SOLUTION: This method comprises steps of: supplying a hole generating material and a framework generating material to the surface of a substrate by vapor phase; forming a thin film wherein the framework generated by the framework generating material is so demarcated as to enclose the hole generating material on the substrate surface; and forming holes by removing the hole generating material from the thin film to form a porous thin film which is so formed that the framework encloses the holes. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007073914(A) 申请公布日期 2007.03.22
申请号 JP20050262598 申请日期 2005.09.09
申请人 ROHM CO LTD;ASM JAPAN KK 发明人 OKU YOSHIAKI;NAKANO AKINORI
分类号 H01L21/316;C23C14/34;H01L21/768;H01L23/522 主分类号 H01L21/316
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