发明名称 CIRCUIT BOARD AND ITS MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a high-definition film circuit board with flexibility. SOLUTION: A support layer 3 for reinforcement made from glass or ceramics is formed on one surface of a flexible film 1 by a thin film forming method, and on the other surface of the flexible film 1, a metal layer 4 with a circuit pattern is then formed to produce a circuit board 31a. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007073935(A) 申请公布日期 2007.03.22
申请号 JP20060207911 申请日期 2006.07.31
申请人 SEIKO INSTRUMENTS INC 发明人 HAYASHI KEIICHIRO
分类号 H05K1/02;H01L21/60;H05K3/06 主分类号 H05K1/02
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