摘要 |
PROBLEM TO BE SOLVED: To provide a high-definition film circuit board with flexibility. SOLUTION: A support layer 3 for reinforcement made from glass or ceramics is formed on one surface of a flexible film 1 by a thin film forming method, and on the other surface of the flexible film 1, a metal layer 4 with a circuit pattern is then formed to produce a circuit board 31a. COPYRIGHT: (C)2007,JPO&INPIT |