发明名称 MAGNESIUM OXIDE FILLER FOR COMPOUNDING IN RESIN AND HEAT-CONDUCTIVE RESIN COMPOSITION CONTAINING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a magnesium oxide filler for compounding in resins, which gives molded articles excellent in moldability, heat conductivity and water resistance, and to provide a heat-conductive resin composition containing the same. SOLUTION: This magnesium oxide filler for compounding in resins, having a purity of≥95.0 mass%, is characterized by having a BET specific surface area of≤5.0 m<SP>2</SP>/g, a volume-average particle diameter (Dv) of 0.5 to 60μm, and a volume-average particle diameter (Dv)/number-average particle diameter (Dn) ratio of 10 to 55. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007070608(A) 申请公布日期 2007.03.22
申请号 JP20060210311 申请日期 2006.08.01
申请人 TECHNO POLYMER CO LTD;KONOSHIMA CHEMICAL CO LTD 发明人 MATSUZAKA KUNIO;FUJIOKA SHINSUKE;WATANABE MASAYA;MATSUMOTO YASUHIRO
分类号 C08K3/22;C01F5/02;C08L101/00 主分类号 C08K3/22
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