| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder resist resin composition for prior tin plating excellent in low bowing property, solvent resistance and electrical insulation property, and its cured product. SOLUTION: This solder resist resin composition for prior tin plating comprises a resin having a repeating unit represented by general formula (I) (wherein, a plurality of R's represent each independently an 8-9C alkylene group, a plurality of X's represent each independently a 2-18C alkylene group or arylene group, m and n represent each independently an integer of 1-20, and Y represents a tetravalent organic group) (as A component). The cured product using it is provided. COPYRIGHT: (C)2007,JPO&INPIT
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