| 摘要 |
An apparatus for manufacturing a semiconductor device having a powder formation preventing function in a shutter room is provided to reduce wafer contamination by using a powder blowing prevention unit. A purge gas input unit(50) is installed from the outside to an inner end of a shutter room(20) to increase pressure of the shutter room with respect to a portion of residual gas of a process chamber(10) that is flowing to a loadlock chamber(30). A powder blowing prevention unit(60) is made of a laminated filter in the shutter room and prevents a blowing of a powder upon generation of a vortex flow of a purge gas outputted from the purge gas input unit. An adhesion preventing coating layer having a uniform thickness is formed along an inner wall of the shutter room.
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