| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition and a photocurable resin composition useful for a printed wiring board. <P>SOLUTION: The photosensitive resin composition contains a modified polyvinyl alcohol, having a linking unit represented by general Formula (1) in a molecular backbone. <P>COPYRIGHT: (C)2007,JPO&INPIT |
