发明名称 THROUGH-HOLE-FORMING ADHESIVE SHEET AND METHOD FOR PRODUCING THE SAME SHEET
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method for producing a through-hole-forming adhesive sheet in which integration of through holes of adjacent through hole groups can be prevented even when using a plurality of scanning apparatuses and to provide a through-hole-forming adhesive sheet in which integration of through holes of adjacent through hole groups were prevented. <P>SOLUTION: The method for producing a through hole-forming adhesive sheet 1 comprises irradiating a bilayer sheet IP' composed of a substrate 11 and an adhesive layer 12 with laser light by using a laser processing apparatus in which a plurality of galvanometer mirrors 33 for scanning laser light in a prescribed range and at prescribed intervals are arranged in series to form a through hole 2 in the bilayer sheet 1P'. In the production method, a plurality of scanning lines SL of laser light by a plurality of galvanometer mirrors 33 are shifted between adjacent scanning lines SL so that a plurality of scanning lines are mutually not overlapped. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007070440(A) 申请公布日期 2007.03.22
申请号 JP20050257875 申请日期 2005.09.06
申请人 LINTEC CORP 发明人 HAGIWARA SHINJI;MATSUBAYASHI YUMIKO;TSUDA KAZUHISA
分类号 C09J7/02;C09J201/00 主分类号 C09J7/02
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