| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor laser module in which a semiconductor laser element is bonded surely to a submount and curvature profile of the semiconductor laser element is corrected precisely, and to provide a semiconductor laser stack where a plurality of semiconductor laser elements are stacked. <P>SOLUTION: The semiconductor laser module comprises a submount 9, a semiconductor laser element 5 provided on the submount 9, and a submount 3 provided on the semiconductor laser element 5 wherein the semiconductor laser element 5 has an active layer 11a provided on a surface layer facing the submount 9, and the submount 9 has a coefficient of thermal expansion larger than that of the submount 3. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
