| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoelectric conversion device in which thermal stress is suppressed while sustaining thermoelectric conversion efficiency. SOLUTION: The thermoelectric conversion device comprises at least a pair of P type semiconductor element 20 and N type semiconductor element 10 for thermoelectric conversion juxtaposed between heat exchange substrate 1 and 2 opposing each other, electrode plates 30, 40 and 50 interposed between one substrate and the element and between the other substrate and the element in order to connect the P type and N type elements alternately in series, through holes 10b and 20b penetrating from one substrate to the other through the electrode plate and the P type element 20 and penetrating from one substrate to the other through the electrode plate and the N type element 10, a rod member of a bolt 60a inserted into the through holes 10b and 20b while insulated from the inner circumferential surface thereof, a nut 60b coupled with the opposite ends of the rod member through the opposite ends of the through hole such that the element and an opposing electrode plate are pressed, and a spring 70 interposed between one end of the through hole and a press member such that the element and an opposing electrode plate are pressed slidably. COPYRIGHT: (C)2007,JPO&INPIT
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