发明名称 HEATING FLOOR
摘要 PROBLEM TO BE SOLVED: To provide a heating floor having approximately uniform stepping quality even at a peripheral portion of a header mounting portion. SOLUTION: In this heating floor having a basic structure formed by successively stacking a plate-shaped body layer 1, a mat layer 2 incorporating fluid piping 4, and a cushion layer 3 in this order, and provided with a header 5 on a part of a foamed body layer and the cushion layer, the cushion layer is replaced by a hard layer at the circumference of a header mounting position. Further in this heating floor having the structure formed by successively stacking the plate-shaped body layer, the mat layer incorporating the fluid piping and the cushion layer in this order, and provided with the header on a part of the foamed body layer and the cushion layer, an elastic layer is disposed between the plate-shaped body layer and the mat layer at the circumference of the header mounting position. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007071417(A) 申请公布日期 2007.03.22
申请号 JP20050256240 申请日期 2005.09.05
申请人 SEKISUI CHEM CO LTD 发明人 ASHIZUKA RYOSUKE;OKABE MASASHI;TAKEZAKI HIDEAKI;UNE SOICHI
分类号 F24D3/16;E04F15/18 主分类号 F24D3/16
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