| 摘要 |
A contact assembly and an LSI chip inspecting device using the same are disclosed. The contact assembly is mounted between an electronic device to be tested and a circuit inspecting device to electrically connect them. The contact assembly includes contacts, each of which includes vertical type probes and a ribbon-shaped resin film to which the vertical type probes are mounted apart from each other in a longitudinal direction of the ribbon-shaped resin film, a position determining member for overlapping the contacts in a thickness direction of the contact such that the contacts are separated from each other, and fixing the contacts, and a guide block which is formed with an opening for receiving the contacts. The guide block is formed with a recess in which the position determining member is seated, so that terminals of the vertical type probes protrude above and below surface planes of the guide block, perpendicularly thereto. The position of the contacts, which are arranged with a predetermined angle with respect to an X-axis of arrangement of terminals mounted on XY perpendicular coordinates, can be retained very accurately, and an assembling process is facilitated.
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