发明名称 |
CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING |
摘要 |
An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate. A plurality of perforations may be formed in the polishing article for flow of material therethrough. An electrode is also exposed to the polishing surface by at least a portion of the plurality of perforations. The article of manufacture may also include a polishing surface having a plurality of grooves, wherein a portion of the plurality of grooves intersect with a portion of the plurality of perforations.
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申请公布号 |
US2007066201(A1) |
申请公布日期 |
2007.03.22 |
申请号 |
US20060556011 |
申请日期 |
2006.11.02 |
申请人 |
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发明人 |
CHEN LIANG-YUH;WANG YUCHUN;WANG YAN;DUBOUST ALAIN;CARL DANIEL A.;WADENSWEILER RALPH;BIRANG MANOOCHER;BUTTERFIELD PAUL D.;MAVLIEV RASHID;TSAI STAN D. |
分类号 |
B23F21/03;B24B37/04;B24D99/00 |
主分类号 |
B23F21/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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