发明名称 VACUUM FILM FORMING APPARATUS AND VACUUM FILM FORMING METHOD
摘要 <p>This invention provides a vacuum film forming apparatus that, in subjecting a second mold on the side of a work chamber in which a work is placed, to mold matching to a first mold on the side of a target chamber in which a target for vacuum film formation is placed, followed by vacuum film formation on the work, can shorten the time necessary for the step of vacuum film formation and can reduce the cost. A shutter device (13) is provided on an opening end of a mold (7a) for film formation on the side of a target chamber (7b) in which a target for vacuum film formation is placed. The shutter device (13) comprises first and second support plates (19, 20) having continuous holes (19a, 20a) and a shutter (17) disposed between both the plates (19, 20) for opening/closing the continuous holes (19a, 20a). The shutter (17) is opened after the mold matching and is closed in a stage after the formation of a film (2a) and before mold release.</p>
申请公布号 WO2007032297(A1) 申请公布日期 2007.03.22
申请号 WO2006JP317954 申请日期 2006.09.11
申请人 OSHIMA ELECTRIC WORKS CO., LTD.;UMEZAWA, TAKAO;KITAZUME, ATSUO;TAKANO, HIROSHI;OYAMA, FUSAMI 发明人 UMEZAWA, TAKAO;KITAZUME, ATSUO;TAKANO, HIROSHI;OYAMA, FUSAMI
分类号 C23C14/50 主分类号 C23C14/50
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