| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a new wafer level chip size package (WL-CSP) which can achieve a lighter, slimmer, shorter, and smaller image sensor module, and to provide a method of manufacturing the same. <P>SOLUTION: A method of manufacturing a wafer level chip size package for an image sensor module includes: a step of bonding an image sensor wafer and a glass wafer coated with an IR cut filter layer, and then of forming through-holes in the image sensor wafer; a step of filling the through-holes with a conductive material to form conductors; and a step of forming a solder bump at the end of each conductor, and then of joining the solder bumps to a PCB substrate on which a circuit is formed. The wafer level chip size package is especially characterized by a structure in which the glass wafer coated with the IR cut filter layer is bonded to the image sensor wafer through a polymer partition wall, and the solder bumps are formed on back electrodes of the image sensor wafer that are connected to I/O electrodes of the image sensor wafer respectively through the conductors in the through holes. <P>COPYRIGHT: (C)2007,JPO&INPIT |
