| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder resist resin composition for preplating of tin exhibiting low warpage, and excellent solvent resistance and electric insulation, and to provide its cured object. SOLUTION: A solder resist resin composition for preplating of tin contains resin having an iteration unit shown by general formula (I). Its cured object is also provided. In the formula, a plurality of R represent an alkylene group of 8-9C which may be branched independently, a plurality of R' represent an alkylene group of 1-20C, independently, a plurality of X represent an alkylene group or an arylene group of 2-18C, independently, m, m', m", n, n' and n" represent an integer of 1-20, independently, and p, q and r represent some numeral values satisfying a relation of 1>p/(p+q+r)≥0.3. COPYRIGHT: (C)2007,JPO&INPIT
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