| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for a piezoelectric device capable of obtaining a structure for securely seam-weld sealing the package having an outside dimension of approximate 2.50 mm×2.00 mm. SOLUTION: The package for the piezoelectric device comprises a package body 1 having a dimple on its upper surface, and a metal cap 2 for airtight sealing the dimple. The package body 1 comprises; a mounting substrate having a tabular ceramic substrate 1a, an external electrode for a surface mount formed at the bottom of the insulating substrate, a pad electrode for mounting a piezoelectric vibration element formed on the upper surface of the insulating substrate, and a metalization film annularly formed along the peripheral border on the upper surface of the insulating substrate; and a metal sealing ring having a rectangle cross section fixed to the metalization film by a silver solder and forming an external wall of the dimple. The package is constructed so that the outside dimension of the sealing ring is approximately identical with that of the metal cap. COPYRIGHT: (C)2007,JPO&INPIT
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