发明名称 BONDED SUBSTRATE, BONDING METHOD AND METHOD FOR MANUFACTURING MICROREACTOR
摘要 PROBLEM TO BE SOLVED: To provide a bonded substrate, a bonding method, and a method for manufacturing a microreactor wherein the bonding accuracy of the anodic bonding between two glass substrates can be improved. SOLUTION: In the bonding method for bonding a first glass substrate 1 and a second glass substrate 2, a metal film 3 is formed on one surface of the first glass substrate 1, and the metal film 3 is contacted with the second glass substrate 2 so that the metal film 3 is exposed when a planar view is taken from the side of the second glass substrate 2. An anode 5 is contacted with the exposed metal film 3, a cathode 6 is contacted with the second glass substrate 2, and a voltage is applied to perform the anodic bonding between the first and second glass substrates 1 and 2. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007070176(A) 申请公布日期 2007.03.22
申请号 JP20050260301 申请日期 2005.09.08
申请人 CASIO COMPUT CO LTD 发明人 TERASAKI TSUTOMU
分类号 C03C27/08;B01J19/00;B81B1/00;B81C3/00 主分类号 C03C27/08
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