| 摘要 |
PROBLEM TO BE SOLVED: To provide an inkjet head in which processing and forming a fine electrode wiring pattern are easily performed, which has a thermal expansion coefficient close to the thermal expansion coefficient of a head chip, and in which a driving electrode provided in a channel can be connected with the external wiring from the back end of the head chip by using a wiring substrate excellent in ink resistance. SOLUTION: The inkjet head is characterized in that a connecting electrode which is electrically connected to the driving electrode is formed on the back face of the head chip, the wiring substrate on which a wiring electrode corresponding to the connecting electrode is formed is connected thereto so that the connecting electrode and one end of the wiring electrode are electrically connected with each other, the wiring substrate consists of a silicon substrate in which an ink feeding passage is formed, and has a projecting part projecting in the direction intersecting at right angles to the arranging direction of the channels from the head chip, and another end of the wiring electrode is drawn out to the projecting part. COPYRIGHT: (C)2007,JPO&INPIT
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