发明名称 |
Light emitting diode package and method for manufacturing the same |
摘要 |
The invention relates to a light emitting diode package that can prevent deterioration of phosphor and a method of manufacturing the same. The light emitting diode package includes a package body having a recessed part, a light emitting diode chip mounted on a floor surface of the recessed part and a lens structure disposed on an upper surface of the package body, apart from the light emitting diode chip. Phosphor is dispersed in at least a part of the lens structure.
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申请公布号 |
US2007063214(A1) |
申请公布日期 |
2007.03.22 |
申请号 |
US20060524278 |
申请日期 |
2006.09.21 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM YONG S.;CHOI SEOG M.;LIM CHANG H.;KIM YONG S. |
分类号 |
H01L33/44;H01L33/50;H01L33/56;H01L33/58 |
主分类号 |
H01L33/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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