METHOD FOR MANUFACTURING LED WAFER WITH LIGHT EXTRACTING LAYER

摘要

A method for providing an inorganic LED wafer with an inorganic structured light extraction layer, comprising providing a coating of a sol-gel precursor on said wafer, ensuring that the surface of said sol-gel coating is susceptible to embossing, embossing a structure in the sol-gel coating using soft-lithography, and curing the sol-gel layer, thereby forming said light extraction layer. The invention is based on the understanding that sol-gel precursors, because of their properties before a final curing step, constitute a suitable base material for soft lithography, and that their optical properties make them suitable for use as optical components. Compared to traditional optical lithography the soft lithography requires fewer processing steps and is thus faster and less expensive, both in terms of production cost as well as investment cost.