发明名称 BACKLIGHT MODULE AND A LIGHT-EMITTING-DIODE PACKAGE STRUCTURE THEREFOR
摘要 The LED package structure includes a substrate, an LED chip, a plastic package body, and two leading legs. In addition, the LED chip is arranged on the substrate and covered by the packaging plastic body. Moreover, the plastic package body contains a light-converging part and a light-scattering part, in which the light-converging part has a first axis and the light-scattering part has a second axis. In addition, the first axis of the light-converging part intersects the second axis of the light-scattering part. Furthermore, one terminal of each of the two leading legs is electrically connected to the LED chip while another terminal extends out of the packaging plastic body. Because the LED package structure can converge light and scatter light in different directions, the backlight module implementing the LED package structure has the advantage of a shorter light-mixing distance and better light utilization.
申请公布号 US2007063210(A1) 申请公布日期 2007.03.22
申请号 US20050162724 申请日期 2005.09.21
申请人 CHIU TIEN-LUNG;TSENG WEI-YANG 发明人 CHIU TIEN-LUNG;TSENG WEI-YANG
分类号 H01L33/58 主分类号 H01L33/58
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