发明名称 PHOTOSENSITIVE COMPOSITION AND PATTERN FORMING METHOD USING PHOTOSENSITIVE COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive composition used in a process of producing a semiconductor such as IC, in production of a circuit board of a liquid crystal, a thermal head or the like and in another photofabrication process, excellent in pattern profile and exposure latitude, and improved in sensitivity in EUV exposure and dissolution contrast, and a pattern forming method using the photosensitive composition. <P>SOLUTION: The photosensitive composition contains a compound of a specific structure. The pattern forming method using the photosensitive composition is also provided. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007071902(A) 申请公布日期 2007.03.22
申请号 JP20050255361 申请日期 2005.09.02
申请人 FUJIFILM CORP 发明人 WADA KENJI;KODAMA KUNIHIKO
分类号 G03F7/004;G03F7/038;G03F7/039;H01L21/027 主分类号 G03F7/004
代理机构 代理人
主权项
地址