| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a thermal spray film-coated member for various semiconductor devices which is small in the damage due to corrosion action in an environment containing a halogen compound or the like and free from the degradation of the quality of the semiconductor processing device and the increase of the manufacture cost caused by the environmental contamination by corrosive materials. <P>SOLUTION: The thermal spray film-coated member having excellent sticking and deposition characteristics of particles or the like, prevented from the re-scattering of the particles effectively and having excellent plasma erosion resistance is obtained by irradiating the surface of a thermal spray film formed on the surface of a base material and comprising Al<SB>2</SB>O<SB>3</SB>, Y<SB>2</SB>O<SB>3</SB>or an Al<SB>2</SB>O<SB>3</SB>-Y<SB>2</SB>O<SB>3</SB>multiple oxide with electron beam. <P>COPYRIGHT: (C)2007,JPO&INPIT |
