| 摘要 |
PROBLEM TO BE SOLVED: To prevent positional displacement of a wafer and coming-off of the same without lowing of a maintenance cycle and without giving an influence to a distribution of plasma. SOLUTION: A semiconductor manufacturing apparatus comprises a processing chamber 101 capable of processing a semiconductor wafer 106, a semiconductor wafer placement base provided with an electrostatic chuck 105 for placing and holding a semiconductor wafer in the processing chamber, a wafer lift pin 109 for moving the semiconductor wafer to a conveyance position on the semiconductor wafer placement base, and further at least two or more of elevatable guide pins 111 capable of positioning the semiconductor wafer on the outside from a region on the semiconductor wafer placement base on which the semiconductor wafer is placed. It is possible to prevent positional displacement and coming off of the wafer caused by bouncing of the guide pins occurring when the guide pins are protruded to surround the wafer, after completion of process treatment of the wafer to release the wafer from the electrostatic chuck. COPYRIGHT: (C)2007,JPO&INPIT |
