TAPE FOR WAFER PROCESSING

摘要

PROBLEM TO BE SOLVED: To provide a tape for wafer processing excellent in cutting ability suitable as a semiconductor wafer dicing die-bond tape used for an adhesion process for piling it with a lead frame or semiconductor chip after dicing. SOLUTION: In a tape 10 for the wafer processing, adhesives layers 3, 4 are formed through an intermediate resin layer 2 consisting of thermosetting resin composite on a substrate film 1. A storage modulus of the intermediate resin layer 2 at 80°C is greater than that of the adhesives layers 3, 4 at 80°C. COPYRIGHT: (C)2007,JPO&INPIT