| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid ejection head in which stripping of a bonding wire is prevented and a drive IC and the bonding wire are sealed surely. SOLUTION: The liquid ejection head comprises a drive IC 120 for driving a pressure generation element, a bonding wire 130 for connecting a wire led out from the pressure generation element electrically with the drive IC 120, and a head case provided by an IC holding section 151, i. e. a space surrounding the drive IC 120, penetrating in the thickness direction wherein the drive IC 120 and the bonding wire 130 are covered with a potting agent layer 250 provided in the IC holding section 151. The potting agent layer 250 has a two-pack type potting agent layer 251 composed of a two-pack type potting agent covering at least the joint of the bonding wire 130 and the lead wire, and a one-pack type potting agent layer 252 composed of a one-pack type potting agent applied onto the two-pack type potting agent layer 251. COPYRIGHT: (C)2007,JPO&INPIT
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