发明名称 FLUX COMPOSITION FOR SOLDERING, RESIN FLUX CORED SOLDER, AND SOLDER PASTE
摘要 PROBLEM TO BE SOLVED: To provide a flux for a surface mounting operation using a lead-free solder in the atmosphere, which flux is excellent in the storage stability, and is excellent in the workability because the scatter of the flux and the solder and the unpleasant odor hardly occur, and can show a high conforming rate of products because of its excellent wettability, and can improve the manufacturing efficiency, and can obtain the excellent soldering property without causing a defective joint, such as a void, and further can achieve high reliability because corrosive components hardly remain in the debris of the flux after the actual mounting. SOLUTION: The flux composition for soldering contains 2, 2, 2-tribromoethanol as an activator. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007069258(A) 申请公布日期 2007.03.22
申请号 JP20050261420 申请日期 2005.09.09
申请人 UCHIHASHI ESTEC CO LTD 发明人 TANAKA YOSHIAKI
分类号 B23K35/363;B23K35/26;C22C13/00;C22C13/02;H05K3/34 主分类号 B23K35/363
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