| 摘要 |
<p>A light emitting device package and a method for manufacturing the same are provided to simplify its structure and reduce a manufacturing cost by dividing a conductive sub-mount substrate into two regions. A conductive sub-mount substrate(100) is divided into a first region and a second region by an insulating region. A groove is formed on an upper surface of the first region. A light emitting device(200) includes a lower electrode and an upper electrode. The light emitting device is mounted in the groove of the first region. The lower electrode is electrically connected with the first region. An electrode pad(121) is formed on the second region of the conductive sub-mount substrate. A conductor is used for connecting electrically the electrode pad with the upper electrode.</p> |
