发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of controlling a pressure in its processing chamber to be maintained to a predetermined value, and of discharging a stored liquid independently of variations in an external pressure. SOLUTION: The substrate processing apparatus includes: a reservoir 36 provided to an exhaust line 4 for exhausting a processing gas in the processing chamber 19, and for storing a liquid contained in the processing gas; a liquid discharge line 37 provided to a downstream side from the reservoir 36, and for discharging the liquid from the reservoir 36; a pressure control means 24 for controlling the pressure in the processing chamber 19; an absolute pressure detection means 24b for detecting the pressure in the processing chamber 19 in unit by an absolute pressure; and a differential pressure detection means 23 for detecting the pressure in the processing chamber 19 by a differential pressure from the external pressure. The substrate processing apparatus controls the liquid discharge line 37 so as not to be communicatively connected to the outer part of the apparatus, while controlling the pressure control means 24 on the basis of a detection value detected by the absolute pressure detection means 24b when processing the substrate; and controls the liquid discharge line 37 so as to be communicatively connected to the outer part of the apparatus on the basis of a detection value detected by the differential pressure detection means 23. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007073880(A) 申请公布日期 2007.03.22
申请号 JP20050262122 申请日期 2005.09.09
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 TAKEKUMA YUKIHIKO;MIYASHITA NAOYA;OKAMIYA HIROKI;MORIKAWA HARUO
分类号 H01L21/31;H01L21/22 主分类号 H01L21/31
代理机构 代理人
主权项
地址