摘要 |
PROBLEM TO BE SOLVED: To provide a soldering method which solves the soldering failure due to excessive fused solder upon soldering while applying internal pressure inside through-holes in a lead component mounting substrate. SOLUTION: (a) In the primary soldering process, the lead component mounting substrate 2 is lowered, and the rear face thereof is brought near or in close contact to the upper open end edge of a nozzle 52. At the same time, by raising the surface of fused solder Sa supplied to the nozzle 52, the supplying pressure of the fused solder from the nozzle 52 is applied inside the through-hole 4 in the lead component mounting substrate 2. (b) In the secondary soldering process, by lowering the surface of the fused solder Sb, the rear face of the lead component mounting substrate 2 is relatively moved apart from this surface, and only the leads 5 are immersed in the surface of the fused solder Sb in the nozzle 52 for a fixed time or longer time. (c) In the lead withdrawing process, by tilting and raising the lead component mounting substrate 2, it is withdrawn from the surface of the fused solder in the nozzle 52. COPYRIGHT: (C)2007,JPO&INPIT
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