发明名称 METHOD AND DEVICE FOR DISCHARGING SOLDER MATERIAL
摘要 PROBLEM TO BE SOLVED: To discharge a solder material without providing a valve body at a drain portion for discharging the solder material stored in a solder basin, and further to stop the discharge. SOLUTION: A discharging device comprises the solder basin 101 for storing the solder material, a drain portion 201 which is arranged below the solder basin 101 so as to project downward, and discharges the solder material stored in the solder basin 101 after passing the inside thereof, a cartridge heater 104 for melting the solder material solidified in the drain portion, and a radiating means for radiating the heat stored in the drain portion 201. Since there is no sliding portion, such as a valve, solder dregs do not jam, and the solder material can be discharged. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007069237(A) 申请公布日期 2007.03.22
申请号 JP20050258787 申请日期 2005.09.07
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 IGARI TAKASHI;SUETSUGU KENICHIRO;HIBINO TOSHIHARU;TANAKA MASATO
分类号 B23K3/06;B23K1/08 主分类号 B23K3/06
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