| 摘要 |
In a multilayer circuit board of the present invention, a plurality of circuit substrates configured by forming a circuit pattern on an insulating base material are stacked via an insulating layer, a through-hole and a via hole are formed in the layering direction, and laser processability and laser processing speed for a processing laser beam used in formation of the through-hole and the via hole are about the same for the insulating substrate material and the insulating layer.
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