| 摘要 |
PROBLEM TO BE SOLVED: To improve measurement accuracy by preventing a measurement error caused by a parasitic capacity of a probe pin, by improving a technology for measuring the inductance of a magnetic head by bringing a current application probe pin and a voltage measuring probe pin into contact with a pad of the magnetic head formed on a wafer. SOLUTION: When taking a magnetic head 1 into consideration from among a plurality of magnetic heads 1A-1D, the current application probe pin 5a is extended to a pad 2a from its +Y side and brought into contact with the pad 2a, and the voltage measuring probe pin 6a is extended from the -Y side of the pad 2a and brought into contact with the pad 2a. Hereby, since the current application probe pin 5a and the voltage measuring probe pin 6a are not faced each other in the parallel state, a parasitic capacity is not generated between both probe pins. A pad 2b is put in the similar state, and the other magnetic heads are put in the similar state. Thus, the measurement error caused by a parasitic capacity is prevented, and the inductance measurement accuracy is improved. COPYRIGHT: (C)2007,JPO&INPIT
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