| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed wiring board laminating a plurality of conductive circuit layers and exhibiting good solder heat resistance, wherein an adhesive composition exhibiting excellent adhesion strength between a polyimide film used commonly as the substrate of a flexible printed wiring board and a conductive circuit surface, between the polyimide films, and between the conductive circuit surfaces, and also excellent storage stability, is employed. <P>SOLUTION: Urethane polymer (d) having a iosyanate group, obtained through reaction of a polyol compound (a), organic diisocynate (b), and a diol compound (c) having a carboxyl group, is made to react on a polyamino compound (e) to produce polyurethane poly urea resin (A) having an acid number of 3-25 mgKOH/g. A plurality of conductive circuit layers are laminated through a hardened adhesive layer (III) which is formed of an adhesive composition (I) containing the polyurethane poly urea resin (A), and epoxy resin (B), thereby obtaining a printed board. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
