| 摘要 |
An RF circuit module includes a laminated dielectric substrate defining an RF circuit module and including an upper layer and a lower layer. An IC and an RF filter are disposed in the upper layer, and a power amplifier and an antenna switch are disposed in the lower layer. The antenna switch is disposed near an end surface of the laminated dielectric substrate, and the RF amplifier is disposed at a position at which it partially overlaps the antenna switch in a plan view. The IC and the power amplifier are also disposed at positions at which they partially overlap each other in a plan view.
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