发明名称 O-ring structure of semiconductor device fabricating apparatus
摘要 An O-ring structure of a semiconductor device manufacturing apparatus is provided to perform smoothly an up/down operation of a z-axis cylinder by minimizing the wear and tear of the O-ring structure itself using a quadrant type structure made of viton or kalez materials. An O-ring(100) of a semiconductor device manufacturing apparatus is installed on a z-axis cylinder of a vacuum cassette elevator. The vacuum cassette elevator is used for loading a wafer cassette and transferring wafers from the wafer cassette. The O-ring is formed like a quadrant type structure. The O-ring is made of a predetermined material with relatively enhanced resistance against the wear and tear compared to a teflon material. The predetermined material of the O-ring is a viton material or a kalez material.
申请公布号 KR20070032503(A) 申请公布日期 2007.03.22
申请号 KR20050086783 申请日期 2005.09.16
申请人 发明人
分类号 H01L21/02 主分类号 H01L21/02
代理机构 代理人
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