| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which copes with an increase in chip size attendant on an increase in chip capacity keeping a package size unchanged, and expands the occupied area of a chip against a package size. <P>SOLUTION: The semiconductor device has the same semiconductor chip-laminated package, and electrical connections between the layered semiconductor chips 1 and a wiring board 10 are made by combinations of laminated stud bumps 4 and bonding wires 6 with the shortest loop length. By this connections, the bonding part of the wiring board 10 is reduced in area, and a dimensional limitation is relaxed in a wire bonding operation, so that a chip area is expanded with a package size unchanged so as to cope with an increase in a chip size due to an increase in chip capacity. <P>COPYRIGHT: (C)2007,JPO&INPIT |
