发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor substrate having an impurity-doped polycrystalline semiconductor layer having little variation in impurity concentration on an insulation substrate. SOLUTION: The method of manufacturing the semiconductor substrate having a polycrystalline semiconductor layer containing impurities on the surface of the insulation substrate includes: a process of forming an impurity-doped amorphous semiconductor layer which is more highly doped than the polycrystalline semiconductor layer; a process of forming an impurity-doped amorphous semiconductor layer which is more lightly doped than the polycrystalline semiconductor layer, or an impurity-undoped amorphous semiconductor layer; and a process of crystallizing the amorphous semiconductor layers. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007073641(A) 申请公布日期 2007.03.22
申请号 JP20050257041 申请日期 2005.09.05
申请人 SHARP CORP 发明人 TANAKA MITSUHIRO
分类号 H01L21/20;H01L21/205;H01L21/336;H01L29/786 主分类号 H01L21/20
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