发明名称 |
VACUUM DEPOSITION APPARATUS AND VACUUM DEPOSITION METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum deposition apparatus capable of forming a uniform film on a long belt-like substrate without causing the thermal damage of a crucible and the substrate as well as capable of being simple in the structures of devices configured in the vacuum deposition apparatus, and to provide a vacuum deposition method. SOLUTION: The vacuum deposition apparatus 1 is provided with a substrate conveyor 4 that allows a long belt-like substrate 5 to continuously travel in a vacuum chamber 2 and a crucible 3 for holding a molten evaporation material. The substrate conveyor 4 conveys the substrate 5 in a manner that it is inclined to such a scope that the width direction of the surface of the substrate 5 makes an angle of 7°to 47°with the surface of a molten evaporation material in the crucible 3 in forming a film on the substrate 5. Film formation is carried out by vacuum-depositing molecules evaporated from the evaporation material molten in the crucible 3 on the substrate 5 continuously travelled by the substrate conveyor 4 so as to form the film with uniform thickness. COPYRIGHT: (C)2007,JPO&INPIT
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申请公布号 |
JP2007070707(A) |
申请公布日期 |
2007.03.22 |
申请号 |
JP20050261103 |
申请日期 |
2005.09.08 |
申请人 |
SUMITOMO ELECTRIC IND LTD |
发明人 |
AWATA HIDEAKI;EMURA KATSUJI;YOSHIDA KENTARO |
分类号 |
C23C14/56;C23C14/24 |
主分类号 |
C23C14/56 |
代理机构 |
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地址 |
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