发明名称 POLYACETAL RESIN COMPOSITION AND MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a polyacetal resin composition capable of suppressing a formaldehyde emission to a very low level and of suppressing mold deposit and bleed-out coming from additives. SOLUTION: The polyacetal resin composition is prepared by formulating (A) 100 pts.wt. polyacetal resin with (B) 0.01 to 5.0 pts.wt. specified hydrazide compound. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007070575(A) 申请公布日期 2007.03.22
申请号 JP20050262312 申请日期 2005.09.09
申请人 POLYPLASTICS CO 发明人 KAWAGUCHI KUNIAKI
分类号 C08L59/00;C08J5/00;C08K5/29 主分类号 C08L59/00
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