| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin and/or rubber composition having improved thermal conductivity, especially a sealing material and provide inorganic powder suitable for the production of the composition, etc. SOLUTION: The inorganic powder has an average particle diameter of 5-50μm and comprises a powder mixture composed of spherical inorganic powder having an average sphericity of≥0.85 and a thermal conductivity of≥10 W/mK and nonspherical inorganic powder having an average particle diameter smaller than that of the spherical powder, high thermal conductivity and an average sphericity of <0.85. The invention further provides a resin and/or rubber composition, especially a sealing material mixed with the inorganic powder. COPYRIGHT: (C)2007,JPO&INPIT
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