| 发明名称 |
METHOD OF PREVENTING A PEELING ISSUE OF A HIGH STRESSED THIN FILM |
| 摘要 |
A wafer including a high stressed thin film thereon is lifted, and a pre-heating process is performed while the wafer is lifted. Subsequently, a dielectric layer is deposited on the high stressed thin film.
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| 申请公布号 |
US2007066026(A1) |
申请公布日期 |
2007.03.22 |
| 申请号 |
US20050162605 |
申请日期 |
2005.09.16 |
| 申请人 |
MAO CHIH-JEN;SHIH HUI-SHEN;YANG KUO-WEI;CHUANG CHUN-HAN;HSIA CHUN-HUNG |
发明人 |
MAO CHIH-JEN;SHIH HUI-SHEN;YANG KUO-WEI;CHUANG CHUN-HAN;HSIA CHUN-HUNG |
| 分类号 |
H01L21/76 |
主分类号 |
H01L21/76 |
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