| 摘要 |
Laser cutting and sawing can be performed on a variety of materials, transparent or non-transparent, including quartz, sapphire, glass, semiconductors, and diamonds. By direct generation of a special laser beam from a laser cavity and/or by shaping of a laser beam, unique characteristics of the beam in X- and Y-axes are utilized in the cutting and sawing of materials. Such a method and apparatus can reduce breakage and weight loss of the processed material while maintaining or increasing the cutting/sawing throughput.
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