| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a grinding tool for adjusting the surface of a surface plate capable of increasing a free abrasive grain holding force in the surface plate to improve a grinding force and imparting such the surface state of the surface plate as to provide a stable constant grinding force immediately after adjustment to the surface plate by imparting a uniform rough surface to the surface plate. <P>SOLUTION: This grinding tool adjusts the surface of the grinding surface plate in a grinding device for grinding a grinding workpiece by disposing a carrier for the grinding workpiece having a hole for holding the grinding workpiece on the grinding surface plate, holding the grinding workpiece in the hole of the carrier, rotating each of the grinding surface plate and the carrier and supplying a free abrasive grain to the grinding surface plate. The grinding tool is made of a synthetic resin elastic grinding tool having a Rockwell hardness (HRS) of -30 to -100. As a result, the grinding workpiece such as a silicon wafer and synthetic quartz glass can be efficiently polished, and a grinding time can be shortened to reduce grinding cost. The variation of the roughness of the surface of the grinding workpiece is small and a polished product of stable quality can be obtained. <P>COPYRIGHT: (C)2007,JPO&INPIT |
