| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve the problem of a plurality of semiconductor elements being unable to be pressed uniformly in the conventional cases, when the plurality of semiconductor elements are mounted on a circuit board. SOLUTION: In the mounting body, one or a plurality of semiconductor element 2 are mounted on the circuit board 1, and resin 11 is arranged between the board 1 and the elements 2. This manufacturing equipment of the semiconductor mounting body is provided with a suction mechanism 4 which arranges a sheet material 3 whose form changes flexibly on the surface of the mounting body of which the surface does not face the board 1 of the element 2, an elevating mechanism 5 and an upper chamber 6 and a pressurization port 8 and an exhaust vent B which press the semiconductor element 3 with the sheet material 3 by applying an atmospheric pressure difference between a side where the element 2 does not exist and a side where the element 2 exists, in such a manner that the pressure on the side where the element 2 does not exist becomes higher than that on the side where the element exists, setting the arranged sheet material 3 as reference.</p> |
